JOJUN EXCELLENT MANUFACTURER OF THERMAL FUNCTIONAL MATERIAL

Focus on heat dissipation, heat insulation, thermal insulation material production for 15 years

Application of thermally conductive materials

We all know that most electronic products are relatively sealed, and large and small electronic components will be packaged inside electronic products. In addition to the need to install various heat dissipation devices, the application of heat-conducting materials is also essential. Why do you say that?

Thermally conductive material is a general term for materials that are coated between the heat generating device and the heat sink device of the product and reduce the contact thermal resistance between the two. In the past, most product designers used to install radiators or fans as a good way to deal with heat dissipation problems of heat sources, but Over time, there is a problem: the actual heat dissipation effect cannot meet expectations.

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As for why you need to use thermally conductive materials? The heat-generating device and the heat-dissipating device are bonded together, and there is an air gap between the two contact interfaces. During the process of heat conduction from the heat source to the radiator, the conduction rate will decrease due to the air gap, which will affect the heat dissipation performance of electronic products, and the thermal conductivity of the material Use is to solve this problem.

The thermal conductive material can reduce the contact thermal resistance between the two by filling the gap between the contact interfaces, ensuring uniform contact between the two planes and efficient heat generation. The use of thermal conductive material can make the heat conduct to the heat dissipation device faster and reduce the temperature of the heat source , and the thermally conductive material is not only used to fill the space between the heat source and the heat sink, but also can be used between the electronic component and the housing, and between the board and the housing.


Post time: Aug-28-2023