JOJUN EXCELLENT MANUFACTURER OF THERMAL FUNCTIONAL MATERIAL

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A brief description of thermally conductive materials – thermally conductive gel

In physics, there are three main ways of heat transmission: heat conduction, heat convection, and heat radiation. The definition of heat conduction is the process of transferring heat between two objects in contact with each other by the thermal movement of microscopic particles. Common The method is to install a cooling device on the surface of the heating source to conduct the heat of the heating source to the cooling device, thereby reducing the temperature of the heating source.

Although the heat-generating device and the heat-dissipating device seem to fit closely, in fact, there is still a large amount of uncontacted area between the two contact interfaces from a microscopic point of view, so a good heat flow channel cannot be formed, resulting in a decrease in the rate of heat conduction. Electronic products The heat dissipation effect is not good.

600-600

Thermally conductive gel is a soft silicone resin thermally conductive gap filling material. Thermally conductive gel has high thermal conductivity, low interface thermal resistance and good thixotropy. It is an ideal material for applications with large gap tolerances. Thermally conductive gel is filled between the electronic components to be cooled and the heat sink/housing, etc., to make them in close contact, reduce thermal resistance, and quickly and effectively reduce the temperature of electronic components.

Thermally conductive gel is one of many gap filling materials for thermally conductive materials. Thermally conductive gel can fully fill the gap between the contact interfaces and remove the air in the gap, thereby reducing the interface contact thermal resistance, so that heat can be quickly transferred to the radiator, thus ensuring Electronic products can run efficiently for a long time, and thermal conductive gel can be applied in automated production lines, so it has good applications in many fields.


Post time: Jul-03-2023