JOJUN-8600 Series Thermal Paste

Compared with thermal pad, thermal paste is softer and has better surface affinity. It can be compressed to a very low thickness, which significantly improves the heat transfer efficiency, and can be compressed to 0.1mm at the lowest. At this time, the thermal resistance can range from 0.08℃·in2/W to 0.3 ℃·in2/W, which can reach the performance of part of the silicone grease. In addition, thermal paste has almost no hardness, after the use of the equipment will not produce internal stress.

Thermal paste is easier to work with than thermal grease. The general use of silicone grease is screen or steel plate printing, or direct brush coating, is very unfriendly to the user and the environment, and because of its certain fluidity, generally can not be used for thicker than 0.2mm occasions.

And the thermal conductivity mud arbitrary molding into the desired shape, for the uneven PCB board and irregular devices (such as batteries, components corner parts, etc.), can ensure good contact. Thermal gel has a certain adhesion, and will not have the problem of oil and dry, has a certain advantage in reliability.