JOJUN-6300 Series Thermal Pad

Short Description:

JOJUN-6300 Series Thermal Pad is a thermally conductive, reinforced material rated at a thermal conductivity of 3.0 W/M-K, low thermal resistances can be achieved at low pressures. This soft interface pad conforms well to minimal pressure, resulting in excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography.

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Product Detail

Product Tags

★ Typical Properties of JOJUN-6300 Series Thermal Pad

Typical Properties Of JOJUN6300
Property	Unit	Product Series	Test Method
Property	Unit	JOJUN6300	Test Method
Color		Customized	Visual
Thickness	mm	0.3-5	ASTM D374
Specific Gravity	g/cc	3	ASTM D792
Hardness	Shore oo	20-70	ASTM D2240
Application Temperature	℃	-50 - +200
Flammability Class		V0	UL94
Thermal Conductivity	W/m-K	3	ASTM D5470
Breakdown Voltage	KV/mm	>6	ASTM D149
Volume Resistivity	ohm-cm	10 ^14	ASTM D257
Dielectric Constant	1MHz	7	ASTM D150

★ Application

Semiconductors to heat sink
Telecommunications equipment
Graphics cards
Memory modules
LED solid state lighting LED
Desktop computers, laptops, servers
Power electronics
LCLCD and PDP flat panel TV

★ Production Process

Mix Stir

Extrusion

Thermal Pad Production Line

Crop

Package

Outgoing Goods

★R&D Center

Voltage Breakdown Tester

Thermal Conductivity Tester

Kneader

Laboratory

★ Features And Benefits

1..One of the key features of the JOJUN-6300 Series Thermal Pad is its soft and highly compliant nature. This makes it easy to handle and fit, even around complex geometries. The pad is also designed to offer low thermal resistance at low pressure, ensuring consistent performance under varying operating conditions.

2.Another highlight of this pad is its excellent adhesive properties. This helps to keep the pad securely in place, even in high-stress environments. The adhesive layer also promotes efficient heat transfer, ensuring that heat is effectively dissipated away from sensitive components.

3.The JOJUN-6300 Series Thermal Pad is ideal for use in a wide range of electronic applications, including GPUs, CPUs, ICs, LED lighting, and more. Its advanced properties make it a reliable, cost-effective, and efficient solution for manufacturers looking to enhance the performance and reliability of their products.

★Certificates

Features of Thermal Products

Features of Thermal Pad

1. Good thermal conductivity: 1-15 W/m-K.
2. Low hardness: The hardness ranges from Shoer00 10~80.
3. Electrically insulating.
4. Easy to assembly.
Features of Thermal Paste

1. Two-part dispensable gap filler, liquid adhesive.
2. Thermal conductivity: 1.2 ~ 4.0 W/m.K.
3. High voltage insulation, high compression, good temperature resistance.
4. Compression application, can achieve automated operations.
Features of Thermal Grease

1. Low oil separation (towards 0).
2. Long-lasting type, good reliability.
3. Strong weather resistance (high and low temperature resistance -40~150 ℃).
4. Moisture resistance, ozone resistance, aging resistance.