JOJUN-6100 Series Thermal Pad

Thermal conductive gaskets are used to fill the air gap between the heating device and the heat sink or metal base. Their flexible and elastic characteristics enable them to cover very uneven surfaces. Heat is transmitted from the separation device or the entire PCB to the metal shell or diffusion plate, which can improve the efficiency and service life of the heating electronic components. The heat conduction pad is installed between the heat dissipation cold plate and the heating chip to transmit the heat generated by the chip to the heat dissipation cold plate, thereby reducing the temperature of the chip. The compression stress will occur when the heat conduction pad is compressed. The compression stress will increase with the increase of the compression amount. When selecting the heat conduction pad, pay attention that the compression stress of the heat conduction pad during compression should not be greater than the maximum required pressure of the heating chip, otherwise the chip will be damaged.