JOJUN EXCELLENT MANUFACTURER OF THERMAL FUNCTIONAL MATERIAL

Focus on heat dissipation, heat insulation, thermal insulation material production for 15 years

Discountable price Lms Soft Silicone High Die Cut Customized Thermal Conductivity Pad

Short Description:

JOJUN-6100 Series Thermal Pad is a no substrate, ultra-thin thermal material rated at a thermal conductivity of 1.0 W/W-K, low thermal resistances can be achieved at low pressures and allows the pad to fill in air voids and air gaps between PC boards and heat sinks or metal chassis with stepped topography, rough surfaces and high stack-up tolerances. JOJUN-6100 Series Thermal Pad is applied to heating units in narrow space, and is naturally tacky, and no adhesive coating is required.


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Product Detail

Product Tags

The extremely rich projects management experiences and one particular to a person support model make the superior importance of small business communication and our easy understanding of your expectations for Discountable price Lms Soft Silicone High Die Cut Customized Thermal Conductivity Pad, High quality, timely services and Aggressive selling price, all acquire us a superior fame in xxx field despite the international intense competition.
The extremely rich projects management experiences and one particular to a person support model make the superior importance of small business communication and our easy understanding of your expectations for China Silicone Thermal Insulation Pad and Thermal Adhesive Pad, With the highest standards of product quality and service, our products have been exported to more than 25 countries like the USA, CANADA, GERMANY, FRANCE, UAE, Malaysia and so on.We are very pleased to serve customers from all over the world!

★ Typical Properties of JOJUN-6100 Series Thermal Pad

Typical Properties Of JOJUN6100

Property

Unit

Product Series

Test Method

JOJUN6100

Color

 

Customized

Visual

Thickness

mm

0.5-5

ASTM D374

Specific Gravity

g/cc

2.8

ASTM D792

Hardness

Shore oo

30-70

ASTM D2240

Application Temperature

-50 – +200

 

Flammability Class

 

V0

UL94

Thermal Conductivity

W/m-K

1

ASTM D5470

Breakdown Voltage

KV/mm

>6

ASTM D149

Volume Resistivity

ohm-cm

10 ^14

ASTM D257

Dielectric Constant

1MHz

7

ASTM D150

★ Application

1. LED industry
The thermal conductive gasket is used between the aluminum substrate and the heat sink.
The thermal conductive gasket is used between the aluminum substrate and the shell.
2. Power industry
Use the heat conduction between MOS tube, transformer (or capacitor/PFC inductor) and heat sink or housing.
3. Communication industry
Thermal conduction and heat dissipation between the main board IC and the heat sink or shell.
Heat conduction and heat dissipation between the set-top box DC-DC IC and the shell.
4. Automotive Electronics Industry
Thermal conductive gaskets can be used in automotive electronic industry applications (such as xenon lamp ballasts, stereos, vehicle series products, etc.).
5. PDP/LED TV
Heat conduction between power amplifier IC, image decoder IC and heat sink (housing).

apoplication

★ Production Process

Mix Stir

Mix Stir

Extrusion

Extrusion

Thermal Pad Production Line

Thermal Pad Production Line

Crop

Crop

Package

Package

Outgoing Goods

Outgoing Goods

★R&D Center

Diagram1

Voltage Breakdown Tester

Diagram2

Thermal Conductivity Tester

Diagram

Kneader

Diagram3

Laboratory

★ Popular Science Knowledge

Thermal conductive gaskets are used to fill the air gap between the heating device and the heat sink or metal base. Their flexible and elastic characteristics enable them to cover very uneven surfaces. Heat is transmitted from the separation device or the entire PCB to the metal shell or diffusion plate, which can improve the efficiency and service life of the heating electronic components. The heat conduction pad is installed between the heat dissipation cold plate and the heating chip to transmit the heat generated by the chip to the heat dissipation cold plate, thereby reducing the temperature of the chip. The compression stress will occur when the heat conduction pad is compressed. The compression stress will increase with the increase of the compression amount. When selecting the heat conduction pad, pay attention that the compression stress of the heat conduction pad during compression should not be greater than the maximum required pressure of the heating chip, otherwise the chip will be damaged.

★ Why Choose Us?

1. Professional R&D team
Application test support ensures that you no longer worry about multiple test instruments.

2. Product marketing cooperation
The products are sold to many countries all over the world.

3. Strict quality control

4. Stable delivery time and reasonable order delivery time control.

We are a professional team, our members have many years of experience in international trade. We are a young team, full of inspiration and innovation. We are a dedicated team. We use qualified products to satisfy customers and win their trust. We are a team with dreams. Our common dream is to provide customers with the most reliable products and improve together. Trust us, win-win.

★ Certificates

ce
The extremely rich projects management experiences and one particular to a person support model make the superior importance of small business communication and our easy understanding of your expectations for Discountable price Lms Soft Silicone High Thermal Conductivity Die Cut Customized Pad, High quality, timely services and Aggressive selling price.
Discountable price China Silicone Thermal Insulation Pad and Thermal Adhesive Pad, With the highest standards of product quality and service, our products have been exported to more than 25 countries like the USA, CANADA, GERMANY, FRANCE, UAE, Malaysia and so on.We are very pleased to serve customers from all over the world!

Features of Thermal Products

  • 1. Good thermal conductivity: 1-15 W/m-K.<br/>
2. Low hardness: The hardness ranges from Shoer00 10~80.<br/>
3. Electrically insulating.<br/>
4. Easy to assembly.<br/>

    Features of Thermal Pad

    1. Good thermal conductivity: 1-15 W/m-K.
    2. Low hardness: The hardness ranges from Shoer00 10~80.
    3. Electrically insulating.
    4. Easy to assembly.

  • 1. Two-part dispensable gap filler, liquid adhesive.<br/>
2. Thermal conductivity: 1.2 ~ 4.0 W/m.K.<br/>
3. High voltage insulation, high compression, good temperature resistance.<br/>
4. Compression application, can achieve automated operations.<br/>

    Features of Thermal Paste

    1. Two-part dispensable gap filler, liquid adhesive.
    2. Thermal conductivity: 1.2 ~ 4.0 W/m.K.
    3. High voltage insulation, high compression, good temperature resistance.
    4. Compression application, can achieve automated operations.

  • 1. Low oil separation (towards 0).<br/>
2. Long-lasting type, good reliability.<br/>
3. Strong weather resistance (high and low temperature resistance -40~150 ℃).<br/>
4. Moisture resistance, ozone resistance, aging resistance.<br/>

    Features of Thermal Grease

    1. Low oil separation (towards 0).
    2. Long-lasting type, good reliability.
    3. Strong weather resistance (high and low temperature resistance -40~150 ℃).
    4. Moisture resistance, ozone resistance, aging resistance.


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